While many of our visitors might be interested by some of our own content pieces, here’s one i found rummaging around ezinearticles that is much better written than I might ever expect to achieve. Maybe one day I will get to this rank, you never know.
CML Microcircuits, a leading innovator and provider of low-power semiconductors for global wireless data and two-way radio communications markets, has released an NXDN processor with embedded Air Interface (AI) Protocol.
The CMX7131/7141 with the NXDN Function Image connects directly to the market-leading CMX994 Direct Conversion Receiver IC. Together, these devices form a formidable chip-set, enabling a fast development cycle for small, highly-integrated, multi-standard capable digital radios that will exhibit a long battery life.
The majority of the NXDN air interface physical layer (layer 1) and data link layer (layer 2) is embedded in the NXDN Function Image, plus a host of advanced features to support the complete radio system and simplify the overall radio design process.
NXDN is an FDMA digital Land Mobile Radio (LMR) open standard and has evolved to become a key narrowband technology in the LMR migration from analogue to digital. NXDN is supported by more than 25 international radio manufacturers and organisations that together form the NXDN Forum.
The new NXDN Function Image adds to the existing suite of CMX7131/7141 function images, now covering dPMR, NXDN, ARIB STD-T98, ARIB STD-T102 and legacy analogue PMR. A radio platform using the CMX7131/7141 can be switched to deliver any of these systems by uploading the appropriate Function Image. This allows radio manufacturers to take advantage of economies-of-scale by adopting a Software Defined Radio (SDR) design route, with one radio design supporting a number of different systems and markets.
The DE9944 FDMA SDR Demonstrator is also available, providing the fastest route from development through to production.
The CMX7131/CMX7141 processors and function images are available now, offering low power 3.3V operation in small VQFN/LQFP packaging.